The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Aug. 03, 2015
Applicant:

Ehwa Diamond Industrial Co., Ltd., Osan-si, Gyeonggi-do, KR;

Inventors:

Jae-Hyun Hong, Hwaseong-si, KR;

Jong Suk Choi, Seoul, KR;

Young Choul Song, Osan-si, KR;

Assignee:

EHWA Diamond Industrial Co., Ltd., Osan-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28D 1/12 (2006.01); B23D 61/02 (2006.01); B23D 61/04 (2006.01);
U.S. Cl.
CPC ...
B28D 1/121 (2013.01); B23D 61/028 (2013.01); B23D 61/04 (2013.01);
Abstract

The present disclosure provides a brazing bond type diamond tool having excellent cuttability. The diamond tool includes a shank having a body with a thickness of 2 mm or less and a tip portion formed along an edge of the body, the tip portion being thinner than the body; and a brazing bond layer formed on the tip portion of the shank to secure diamond particles having a particle size of 25 to 50 mesh with a brazing bond, wherein the brazing bond layer has a greater thickness than a difference between half the thickness of the shank body and half the thickness of the shank tip portion, such that some part of the shank body can penetrate into a surface of an object to be cut, and the tip portion of the shank has a curved surface at an end thereof.


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