The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jun. 29, 2016
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Tsuyoshi So, Kawasaki, JP;
Hideo Kubo, Kawasaki, JP;
Yoshinori Uzuka, Kawasaki, JP;
Nobumitsu Aoki, Kawasaki, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 31/02 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H05K 1/02 (2006.01); H01L 23/473 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); H01L 23/473 (2013.01); H05K 1/0204 (2013.01); H05K 1/0209 (2013.01); B23K 2201/40 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10409 (2013.01);
Abstract
A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.