The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Jun. 20, 2014
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
John Timmerman, Minneapolis, MN (US);
Jeremy J. Schmitz, Minnetrista, MN (US);
Jeremy L Hammond, Stillwater, MN (US);
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 24/29 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32245 (2013.01); Y10T 29/4935 (2015.01);
Abstract
A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.