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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9693462 B1

PDFFull Text
Date of Patent:
Jun. 27, 2017

Filed:

Jul. 02, 2015

Printed circuit board

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Takeshi Hosomi, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 33/62 (2010.01); H01L 23/10 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H05K 7/00 (2006.01); H05K 1/02 (2006.01); H01L 27/146 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/10 (2013.01); H01L 23/13 (2013.01); H01L 23/3135 (2013.01); H01L 23/5389 (2013.01); H01L 33/62 (2013.01); H05K 3/4697 (2013.01); H01L 23/3677 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/16 (2013.01); H01L 27/14618 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/14 (2013.01); H01L 2924/142 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15333 (2013.01); H01L 2924/163 (2013.01); H01L 2924/165 (2013.01); H01L 2924/167 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/1676 (2013.01); H01L 2924/1679 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/16747 (2013.01); H01L 2924/16787 (2013.01); H01L 2924/16788 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H05K 1/021 (2013.01); H05K 1/0206 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/304 (2013.01);
Abstract

A printed circuit board includes: a printed wiring board including an insulating layer wherein a recessed part is provided on a top surface of the insulating layer, and a printed conductor provided inside the recessed part; a bare chip part mounted in the recessed part and electrically connected to the printed conductor; an electronic part mounted on the top surface of the printed wiring board other than the recessed part; and a cap fixed to the top surface of the printed wiring board and hollow-sealing the bare chip part mounted in the recessed part, wherein using a height of the top surface of the printed wiring board as a reference, a height of a top surface of the cap is equal to or below a maximum height of a top surface of the electronic part.

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