The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9693454 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 27, 2017

Filed:

Mar. 29, 2016
Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventor:

Marc Sigle, Alzenau, DE;

Assignee:

MAGNA ELECTRONICS INC., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); B60R 1/00 (2006.01); H05K 1/18 (2006.01); H04N 7/18 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); B60R 1/00 (2013.01); G06K 9/00805 (2013.01); H04N 7/183 (2013.01); H05K 1/181 (2013.01); B60R 2300/8066 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09418 (2013.01); Y02P 70/611 (2015.11);
Abstract

A vehicle vision system includes at least one camera operable to capture image data, and an image processor chip operable to process image data captured by the at least one camera for detecting at least one of a vehicle and a pedestrian present in the field of view of the at least one camera. The image processor chip is surface mounted at a mounting location of a circuit board that has a plurality of solder pads established thereat that correspond to a plurality of respective solder points of the image processor chip. The plurality of solder pads include elongated solder pads having respective longitudinal axes. The mounting location includes first, second, third and fourth quadrants. The longitudinal axes of elongated solder pads disposed at the first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at the second quadrant.


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