The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Feb. 20, 2013
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Tadashi Nagasawa, Kyoto, JP;
Katsura Hayashi, Kyoto, JP;
KYOCERA Corporation, Kyoto-Shi, Kyoto, JP;
Abstract
A wiring board () according to an embodiment of the present invention includes an inorganic insulating layer (A); a first resin layer (A) on one main surface of the inorganic insulating layer (A); a second resin layer (A) on another main surface of the inorganic insulating layer (A); and a conductive layer () partially on one main surface of the second resin layer (A), the one main surface being on an opposite side to the inorganic insulating layer (A). The inorganic insulating layer (A) includes a plurality of first inorganic insulating particles () which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (). A part of the first resin layer (A) and a part of the second resin layer (A) are located inside the gaps (G).