The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Sep. 22, 2016
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Xiaohua Kong, San Diego, CA (US);
Mohamed Allam, Rancho Santa Fe, CA (US);
Esin Terzioglu, San Diego, CA (US);
Jose Gilberto Corleto Mena, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03M 9/00 (2006.01); G05F 3/16 (2006.01); H03L 7/08 (2006.01);
U.S. Cl.
CPC ...
H03M 9/00 (2013.01); G05F 3/16 (2013.01); H03L 7/0807 (2013.01);
Abstract
An SoC integrated circuit package is provided in which the analog components of a SerDes for an SoC die in the SoC integrated circuit package are segregated into a SerDes interface die in the SoC integrated circuit package.