The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Apr. 14, 2015
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Dinhphuoc Vu Hoang, Anaheim, CA (US);

Hardik Bhupendra Modi, Irvine, CA (US);

Hsiang-Chih Sun, Thousand Oaks, CA (US);

Peter J. Zampardi, Jr., Newbury Park, CA (US);

Guohao Zhang, Nanjing, CN;

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H03F 1/02 (2006.01); H03F 3/19 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 29/36 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/812 (2006.01); H01L 29/08 (2006.01); H01L 29/205 (2006.01); H01L 27/06 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H03F 3/60 (2006.01); H03F 3/213 (2006.01); H03F 3/187 (2006.01); H03F 3/347 (2006.01); H01L 29/8605 (2006.01); H01L 21/8252 (2006.01); H01L 27/092 (2006.01); H03F 3/45 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 27/0605 (2013.01); H01L 27/0623 (2013.01); H01L 29/0821 (2013.01); H01L 29/205 (2013.01); H01L 29/36 (2013.01); H01L 29/66242 (2013.01); H01L 29/7371 (2013.01); H01L 29/812 (2013.01); H03F 3/19 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03F 3/60 (2013.01); H01L 21/8252 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 27/092 (2013.01); H01L 29/66863 (2013.01); H01L 29/8605 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48611 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48811 (2013.01); H01L 2224/48816 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85416 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30111 (2013.01); H03F 3/187 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03F 3/347 (2013.01); H03F 3/45 (2013.01); H03F 2200/451 (2013.01);
Abstract

One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET including a semiconductor segment that includes substantially the same material as a layer of a collector of the HBT, the semiconductor segment corresponding to a channel of the PFET; a load line electrically connected to an output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the RF signal; and a harmonic termination circuit electrically connected to the output of the power amplifier and configured to terminate at a phase corresponding to a harmonic frequency of the RF signal. Other embodiments of the module are provided along with related methods and components thereof.


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