The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Sep. 29, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventor:

Junhua Liu, Hayward, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/16 (2006.01); H01R 43/18 (2006.01); B21D 26/033 (2011.01); B21C 37/06 (2006.01); B21C 37/08 (2006.01); B21C 37/15 (2006.01); H01R 13/6581 (2011.01); H01R 24/62 (2011.01);
U.S. Cl.
CPC ...
H01R 43/18 (2013.01); B21C 37/06 (2013.01); B21C 37/08 (2013.01); B21C 37/0803 (2013.01); B21C 37/0815 (2013.01); B21C 37/155 (2013.01); B21D 26/033 (2013.01); H01R 13/6581 (2013.01); H01R 24/62 (2013.01);
Abstract

Methods for forming seamless and jointless metal parts suitable in a manufacturing environment are disclosed. The metal parts can be used in the manufacture of electronic devices and accessories of electronic devices, such as connectors. In particular embodiments, the methods involve forming a seamless cylindrical tube. The seamless cylindrical tube can then undergo a series of shaping processes that retain and exterior seamless surface of the tube. In some embodiments, the shaping processes include a hydroforming process. The methods can be performed without the use of dovetails and other types of visible joints that can complicate the manufacturing process and result in a part with aesthetically unappealing visible joints and seams.


Find Patent Forward Citations

Loading…