The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Jan. 20, 2015
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/40 (2006.01); H01R 13/66 (2006.01); H01R 13/52 (2006.01); H01R 4/02 (2006.01); H01R 13/405 (2006.01); H01R 13/6477 (2011.01); H01R 12/57 (2011.01); H01R 24/60 (2011.01);
U.S. Cl.
CPC ...
H01R 13/665 (2013.01); H01R 4/02 (2013.01); H01R 13/405 (2013.01); H01R 13/52 (2013.01); H01R 13/6477 (2013.01); H01R 12/57 (2013.01); H01R 13/6658 (2013.01); H01R 24/60 (2013.01);
Abstract
A high-speed electrical connector employs a plurality of electrical contacts held together by a dielectric frame. The contacts are electrically coupled to a substrate within the connector. A gasket may be disposed between the dielectric frame and the substrate and configured to block the flow of an overmold material between the dielectric frame and the substrate such that voids are formed between the contacts. The dielectric frame and the overmold may be made from materials containing silica aerogel. The voids and the aerogel materials result in reduced parasitic capacitance between the contacts enabling higher data transfer speeds.