The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Jul. 01, 2016
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Eiichi Matsumoto, Kariya, JP;

Yoshio Hironaka, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/58 (2011.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
H01R 12/585 (2013.01); H01R 13/03 (2013.01);
Abstract

An electronic device includes a substrate, and a press-fit terminal. The substrate includes a first surface, a second surface opposite to the first surface in a thickness direction of the substrate, a through hole, and an electrode formed in the first surface, the second surface, and a wall of the through hole. The press-fit terminal is fit into the through hole from the first surface while being elastically deformed. The press-fit terminal is connected to the electrode by a reaction force due to the elastic deformation of the press-fit terminal. The substrate includes (i) a core layer that is overlapped, in the thickness direction, with a contact portion of the electrode with the press-fit terminal, and (ii) a flexible layer that is at a position closer to the first surface than the core layer is to. The flexible layer has a lower elastic modulus than the core layer.


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