The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

May. 29, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Duixian Liu, Scarsdale, NY (US);

Arun S. Natarajan, Corvallis, OR (US);

Jean-Olivier Plouchart, New York, NY (US);

Scott K. Reynolds, Amawalk, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/36 (2006.01); H01L 21/50 (2006.01); H01L 23/522 (2006.01); H01L 21/302 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/302 (2013.01); H01L 21/486 (2013.01); H01L 21/50 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01Q 1/36 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.


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