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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9691957 B1

PDFFull Text
Date of Patent:
Jun. 27, 2017

Filed:

May. 19, 2015

Light emitting device package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sang-hyun Lee, Suson-si, KR;

Dong-hyuck Kam, Hwaseong-si, KR;

Gam-han Yong, Suwon-si, KR;

Jin-gi Hong, Yongin-si, KR;

Seong-deok Hwang, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Zandra Smith

Assistant Examiner:

Lawrence Tynes, Jr

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 27/15 (2006.01); H01L 33/46 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 27/153 (2013.01); H01L 33/502 (2013.01); H01L 33/505 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/46 (2013.01); H01L 33/54 (2013.01); H01L 2224/13 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12044 (2013.01);
Abstract

The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.

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