The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Oct. 08, 2015
Applicant:
Globalfoundries Inc., Grand Caymay, KY;
Inventors:
Hui Zang, Guilderland, NY (US);
Bingwu Liu, Ballston Spa, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/84 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1207 (2013.01); H01L 21/8234 (2013.01); H01L 21/84 (2013.01);
Abstract
Bulk semiconductor devices are co-fabricated on a bulk semiconductor substrate with SOI devices. The SOI initially covers the entire substrate and is then removed from the bulk device region. The bulk device region has a thicker dielectric on the substrate than the SOI region. The regions are separated by isolation material, and may or may not be co-planar.