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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9691736 B1

PDFFull Text
Date of Patent:
Jun. 27, 2017

Filed:

Oct. 13, 2015

Miniaturized smd diode package and process for producing the same

Applicant:

Sfi Electronics Technology Inc., Taoyuan County, TW;

Inventors:

Ching-Hohn Lien, Taoyuan County, TW;

Xing-Xiang Huang, Taoyuan County, TW;

Hsing-Tsai Huang, Taoyuan County, TW;

Hong-Zong Xu, Taoyuan County, TW;

Yi-Wei Chen, Taoyuan County, TW;

Assignee:

SFI ELECTRONICS TECHNOLOGY INC., Taiwan, CN;

Attorney:

Bacon & Thomas, PLLC

Primary Examiner:

Thao X Le

Assistant Examiner:

Nduka Ojeh

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/02 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01); H01L 29/861 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/4853 (2013.01); H01L 21/4867 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/02 (2013.01); H01L 23/15 (2013.01); H01L 23/3107 (2013.01); H01L 23/49805 (2013.01); H01L 23/49833 (2013.01); H01L 24/96 (2013.01); H01L 29/861 (2013.01); H05K 1/117 (2013.01); H05K 1/144 (2013.01); H05K 1/145 (2013.01); H05K 3/403 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 25/0652 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/32168 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/92 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15798 (2013.01); H01L 2924/181 (2013.01); H01L 2924/186 (2013.01);
Abstract

A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

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