The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Mar. 26, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takeshi Yuasa, Tokyo, JP;

Kiyoshi Ishida, Tokyo, JP;

Yoshihiro Tsukahara, Tokyo, JP;

Kohei Nishiguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 23/5283 (2013.01); H01L 24/02 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14156 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/16227 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10674 (2013.01);
Abstract

A surface mount high-frequency circuit is configured such that a plurality of ground padsand a plurality of external connection ground conductorsare discretely disposed to surround a signal line padand an external connection signal line conductorand a plurality of interlayer connection ground conductorsand that a plurality of columnar ground conductorsare discretely disposed to surround an interlayer connection signal line conductorThus, it is possible to suppress radiation of an unnecessary signal to the outside using a simple production process that is completed by only a wafer process without separately preparing a component such as a shield cover case.


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