The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
May. 29, 2014
Denso Corporation, Kariya, Aichi-pref., JP;
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa-pref., JP;
Shun Sugiura, Kariya, JP;
Yasushi Ookura, Kariya, JP;
Takeshi Fujii, Matsumoto, JP;
Tetsutaro Imagawa, Matsumoto, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor device includes: a semiconductor substrate having an element; a front surface electrode connected to the element; a rear surface electrode connected to the element; a protective film disposed on the front surface of the semiconductor substrate in a separation region; and a temperature sensor disposed on a front surface side of the semiconductor substrate. The front surface electrode is divided into multiple pieces along at least two directions with the protective film. The separation region includes an opposing region located between opposing sides of divided pieces of the front surface electrode adjacent to each other, and an intersection region, at which the opposing region intersects. The temperature sensor is disposed in only the opposing region.