The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Jul. 08, 2016
Applicant:

Harris Corporation, Melbourne, FL (US);

Inventors:

Michael Raymond Weatherspoon, West Melbourne, FL (US);

David B. Nicol, Melbourne, FL (US);

Louis Joseph Rendek, Jr., Melbourne, FL (US);

Assignee:

HARRIS CORPORATION, Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01); H05K 1/18 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/32 (2013.01); H05K 3/4038 (2013.01); H05K 3/467 (2013.01); H05K 3/4688 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/1579 (2013.01); H05K 3/3436 (2013.01); H05K 3/4602 (2013.01); H05K 3/4632 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10674 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49224 (2015.01); Y10T 428/24917 (2015.01);
Abstract

A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.


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