The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Apr. 30, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Daniel Kehrer, Sauerlach, DE;
Ulrich Krumbein, Rosenheim, DE;
Beng-Keh See, Bukit Katil, MY;
Horst Theuss, Wenzenbach, DE;
Helmut Wietschorke, Laberweinting, DE;
Tze Yang Hin, Penang, MY;
Stefan Martens, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 23/315 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 24/83 (2013.01); H01L 25/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.