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H01L 23/04 (2006.01); H01L 23/055 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/053 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/18 (2006.01); H01L 23/498 (2006.01);

U.S. Cl.

CPC ...

H01L 23/055 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 23/053 (2013.01); H01L 23/18 (2013.01); H01L 23/49838 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2924/0002 (2013.01);

Abstract

Provided are a semiconductor device including a terminal, a circuit substrate, and a case body and a method for manufacturing the semiconductor device. A semiconductor device () includes a terminal (), a circuit substrate (), a case body (), and a positioning component (). The terminal () includes a first end portion (), a trunk portion (), and a second end portion (). The first end portion () of the terminal () is secured to the circuit substrate (). The case body () includes a main surface (), an opening portion () on a side opposing the main surface (), and a groove hole () on the main surface () side. A sidewall () and a through hole () are formed in the groove hole (). The terminal () passes through the through hole () toward the main surface () side from the opening portion () side of the case body (), and the second end portion () protrudes from the main surface () of the case body (). The positioning component () with an inclined protrusion portion () formed thereon is secured in the groove hole (). The trunk portion () of the terminal () is pressed by the inclined protrusion portion () of the positioning component () in a direction of the sidewall () of the groove hole () to be sandwiched between the inclined protrusion portion () and the sidewall () and supported in the groove hole ().

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