The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Apr. 04, 2016
Applicant:
Nanopac Technologies, Inc., Fremont, CA (US);
Inventor:
Fred Koelling, Foster City, CA (US);
Assignee:
Abexl Inc., Fremont, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); B22F 1/00 (2006.01); B22F 3/04 (2006.01); B22F 3/093 (2006.01); B22F 5/10 (2006.01); B22F 7/04 (2006.01); H01L 23/498 (2006.01); H01L 27/12 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); B22F 1/0014 (2013.01); B22F 1/0018 (2013.01); B22F 3/04 (2013.01); B22F 3/093 (2013.01); B22F 5/10 (2013.01); B22F 7/04 (2013.01); H01L 23/49827 (2013.01); H01L 27/12 (2013.01); B22F 2007/042 (2013.01); B22F 2301/00 (2013.01); B22F 2301/25 (2013.01); B22F 2303/20 (2013.01); B22F 2304/05 (2013.01); B22F 2998/10 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01);
Abstract
A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material has the steps of: (a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected.