The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Sep. 03, 2012
Applicants:

Hui Guo, Xi'an, CN;

Keji Zhang, Xi'an, CN;

Yuming Zhang, Xi'an, CN;

Pengfei Deng, Xi'an, CN;

Tianmin Lei, Xi'an, CN;

Inventors:

Hui Guo, Xi'an, CN;

Keji Zhang, Xi'an, CN;

Yuming Zhang, Xi'an, CN;

Pengfei Deng, Xi'an, CN;

Tianmin Lei, Xi'an, CN;

Assignee:

Xidian University, Xi'an, Shaanxi, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/26 (2006.01); C23C 16/01 (2006.01); C23C 16/02 (2006.01); C01B 31/04 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/16 (2006.01); C30B 25/02 (2006.01); C23C 14/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02614 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 31/0446 (2013.01); C23C 16/01 (2013.01); C23C 16/0281 (2013.01); C23C 16/26 (2013.01); H01L 21/02378 (2013.01); H01L 21/02527 (2013.01); H01L 21/02661 (2013.01); H01L 21/02664 (2013.01); H01L 29/1606 (2013.01); C01B 2204/04 (2013.01); C23C 14/0605 (2013.01); C30B 25/02 (2013.01);
Abstract

Provided is a process for preparing graphene on a SiC substrate, based on metal film-assisted annealing, comprising the following steps: subjecting a SiC substrate to a standard cleaning process; placing the cleaned SiC substrate into a quartz tube and heating the quartz tube up to a temperature of 750 to 1150° C.; introducing CClvapor into the quartz tube to react with SiC for a period of 20 to 100 minutes so as to generate a double-layered carbon film, wherein the CClvapor is carried by Ar gas; forming a metal film with a thickness of 350 to 600 nm on a Si substrate by electron beam deposition; placing the obtained double-layered carbon film sample onto the metal film; subsequently annealing them in an Ar atmosphere at a temperature of 900 to 1100° C. for 10-30 minutes so as to reconstitute the double-layered carbon film into double-layered graphene; and removing the metal film from the double-layered graphene, thereby obtaining double-layered graphene. Also provided is double-layered graphene prepared by said process.


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