The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Feb. 12, 2016
Kabushiki Kaisha Toshiba, Minato-Ku, JP;
Taizo Tosaka, Yokohama, JP;
Hiroshi Miyazaki, Yokohama, JP;
Sadanori Iwai, Kawasaki, JP;
Shigeki Takayama, Yokohama, JP;
Kei Koyanagi, Yokohama, JP;
Kenji Tasaki, Nakano, JP;
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Abstract
A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminated body including at least the substrate and the high-temperature superconducting layer. The conductor layer covering an outer periphery of the tape-type laminated body. The passage forming body serving as a flowing path of a superconducting current generated in the high-temperature superconducting wire piece. The passage forming body is bonded by a bonding material is arranged on a side surface of the conductor layer, the side surface being located on an opposite side to the high-temperature superconducting layer with respect to the substrate.