The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Oct. 30, 2015
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Zhen-Dong Zhu, Beijing, CN;

Qun-Qing Li, Beijing, CN;

Li-Hui Zhang, Beijing, CN;

Mo Chen, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); G02B 5/18 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 33/50 (2010.01); G03F 7/20 (2006.01); G03F 7/095 (2006.01);
U.S. Cl.
CPC ...
G02B 5/1857 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G02B 5/1809 (2013.01); G03F 7/0002 (2013.01); G03F 7/70691 (2013.01); H01L 33/508 (2013.01); G02B 5/18 (2013.01); G03F 7/095 (2013.01);
Abstract

A method for making a grating includes the following steps. A first photoresist film is formed on a substrate. A second photoresist film is applied on the first photoresist film. A number of first cavities are formed in the second photoresist film, wherein part of the first photoresist film is exposed to form a first exposed part. A number of second cavities are formed, wherein part of the surface of the substrate is exposed to form an exposed surface. A mask layer is deposited on the second photoresist film and the exposed surface of the substrate. A patterned mask layer is formed, and part of the substrate is exposed to form a second exposed part. The second exposed part of the substrate is etched through the patterned mask layer. The patterned mask layer is removed.


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