The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Nov. 20, 2015
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Yoshiki Takahashi, Kariya, JP;

Shigetoshi Fukaya, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, Aichi-pref., JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 3/10 (2006.01); G01R 33/00 (2006.01); G01R 33/07 (2006.01); G01L 3/00 (2006.01);
U.S. Cl.
CPC ...
G01L 3/101 (2013.01); G01R 33/0047 (2013.01); G01R 33/07 (2013.01); G01L 3/00 (2013.01);
Abstract

A cutout portion is formed in a substrate of a magnetic detection device, the cutout portion opening at an outer edge of the substrate. Magnetic detection elements of a magnetic sensor detects magnetic field formed by first and second collector portions. A mold section encapsulates the magnetic detection elements. The magnetic sensor is surface mounted such that a portion of the mold section overlaps with the cutout portion. The first collector portion faces a front surface of the magnetic sensor. A portion of the second collector portion is positioned in the cutout portion to face a rear surface of the magnetic sensor. Accordingly, compared to a case where a cutout portion is not provided, a magnetic circuit gap between the first and second collector portions is reduced.


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