The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Apr. 27, 2015
Denso Corporation, Kariya, Aichi-pref., JP;
Akiyuki Sudou, Takahama, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A second sensor includes a lead wire and is exposed to intake air flowing through a passage outside a housing. A conduction body is conductively-joined to the wire. A lead hole opens on an exposed surface, and the wire or the conduction body is pulled out of the passage through the hole. A predetermined terminal is conductively-joined to the wire or the conduction body which is pulled out through the hole. A mold part is provided by injection-molding from resin fluid to seal a conductively-joined part between the wire or the conduction body and the predetermined terminal. The hole is filled up with a filler material to limit leakage of intake air from the passage. A high resilient part has higher resilience than the filler material and is located between the filler material and the mold part to receive injection pressure at time of the injection-molding of the mold part.