The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Sep. 08, 2014
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventor:

Yukinori Asakawa, Seongnam-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/331 (2006.01); B32B 43/00 (2006.01); H01L 21/762 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 2327/12 (2013.01); B32B 2333/04 (2013.01); B32B 2333/12 (2013.01); B32B 2363/00 (2013.01); B32B 2367/00 (2013.01); B32B 2369/00 (2013.01); B32B 2375/00 (2013.01); B32B 2377/00 (2013.01); B32B 2379/00 (2013.01); B32B 2379/08 (2013.01); B32B 2386/00 (2013.01); B32B 2457/20 (2013.01); H01L 21/76251 (2013.01); H01L 21/76254 (2013.01); H01L 21/76259 (2013.01); H01L 21/78 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1189 (2015.01); Y10T 156/1978 (2015.01);
Abstract

A method of fabricating a device includes providing a process substrate on a carrier substrate, where the process substrate has a rectangular shape with a pair of long sides and a pair of short sides, providing a device on the process substrate, and continuously peeling the process substrate from the carrier substrate along a curve passing through a starting point which is one of vertices the process substrate, where the curve substantially perpendicularly passes through one of the short sides spaced apart from the starting point.


Find Patent Forward Citations

Quick Actions:

Asakawa, Yukinori. (2017). Substrate peeling apparatus and method of fabricating device using the same (U.S. Patent No. 9688062). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9688062

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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