The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Aug. 31, 2011
Applicants:

Tatsuya Shimoda, Nomi, JP;

Mitsunori Kokubo, Numazu, JP;

Yuki Sugiura, Mishima, JP;

Inventors:

Tatsuya Shimoda, Nomi, JP;

Mitsunori Kokubo, Numazu, JP;

Yuki Sugiura, Mishima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/08 (2006.01); B29C 59/02 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); G11B 5/855 (2006.01); G11B 7/26 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); G11B 5/855 (2013.01); G11B 7/263 (2013.01);
Abstract

A transfer system () for transferring a fine transfer pattern (M) formed in a mold (M) to a to-be-molded material (D) provided on a substrate (W) includes a positioning device () configured to position the substrate (W) relative to the mold (M) and to bond the mold (M) and the substrate (W) together after the positioning, and a transfer device () provided separately from the positioning device () and configured to receive the mold (M) and the substrate (W) positioned and bonded together by the positioning device (), and to cure the to-be-molded material (D) while pressing the mold (M) and the substrate (W) thereby to perform transfer.


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