The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Jul. 31, 2012
Applicants:
Robert G Walmsley, Palo Alto, CA (US);
Zhuqing Zhang, Corvallis, OR (US);
Jennifer Wu, Corvallis, OR (US);
Sheldon a Bernard, Corvallis, OR (US);
Silam J Choy, Corvallis, OR (US);
Inventors:
Robert G Walmsley, Palo Alto, CA (US);
Zhuqing Zhang, Corvallis, OR (US);
Jennifer Wu, Corvallis, OR (US);
Sheldon A Bernard, Corvallis, OR (US);
Silam J Choy, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 13/04 (2006.01); B81B 7/00 (2006.01); G01P 15/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); B81B 7/0048 (2013.01); G01P 15/0802 (2013.01); H01L 24/32 (2013.01); H05K 13/0469 (2013.01); B81B 2201/0235 (2013.01); H01L 2224/32014 (2013.01); H05K 2203/06 (2013.01); Y10T 156/10 (2015.01);
Abstract
A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.