The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Sep. 18, 2015
Applicant:
Finisar Corporation, Sunnyvale, CA (US);
Inventor:
Henry Meyer Daghighian, Redwood City, CA (US);
Assignee:
FINISAR CORPORATION, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0231 (2013.01); H05K 1/0298 (2013.01); H05K 1/092 (2013.01); H05K 1/113 (2013.01); H05K 1/162 (2013.01); H05K 1/182 (2013.01); H05K 1/0243 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A capacitor in a multilayer printed circuit board is described. The capacitor may include a via of a via-in-pad type and a dielectric mixture filled in the via of the via-in-pad type. The via may be disposed under an integrated circuit contact pad of the multilayer printed circuit board. The dielectric mixture may include a nanoparticle-sized dielectric powder mixed with an adhesive material.