The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Aug. 26, 2016
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Naoto Morizumi, Yoshinogawa, JP;

Takashi Namie, Anan, JP;

Takashi Nakagawa, Anan, JP;

Daisuke Komoda, Anan, JP;

Hiroaki Shozui, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); H01S 5/022 (2006.01); H01S 5/30 (2006.01); H01S 5/00 (2006.01); H01S 5/024 (2006.01); F21S 8/10 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02208 (2013.01); H01S 5/005 (2013.01); H01S 5/02212 (2013.01); H01S 5/02272 (2013.01); H01S 5/02288 (2013.01); H01S 5/02296 (2013.01); H01S 5/02469 (2013.01); H01S 5/3013 (2013.01); F21S 48/11 (2013.01);
Abstract

A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.


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