The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

May. 26, 2016
Applicant:

Shunsin Technology (Zhong Shan) Limited, Zhongshan, CN;

Inventor:

Fei Ren, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 33/007 (2013.01); H01L 33/0095 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light-emitting diode chip package and a manufacturing process thereof sequentially includes a transparent layer, a fluorescent layer, a wafer layer, a light-emitting diode chip, a dielectric layer, a metal circuit layer, and a protective film and conductive blocks used to draw out the electrodes of the light-emitting diode chip. The outer surfaces of the fluorescent layer and the wafer layer retreat from the fluorescent layer down to the wafer layer to form a slant, and the dielectric layer, the metal circuit layer, and the protective film spread out to coat the slant. Simple techniques at low cost are involved.


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