The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

May. 24, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Yoji Urano, Osaka, JP;

Kenichiro Tanaka, Osaka, JP;

Akifumi Nakamura, Osaka, JP;

Toru Hirano, Osaka, JP;

Hideaki Hyuga, Osaka, JP;

Masanori Suzuki, Osaka, JP;

Teruhisa Yokota, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); F21K 9/27 (2016.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); F21K 9/27 (2016.08); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/504 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0058 (2013.01);
Abstract

An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.


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