The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Jun. 06, 2011
Applicants:

Chi Keung Chan, Sheung Shui, HK;

Chak Hau Pang, Fanling, HK;

Fei Hong LI, Huizhou, CN;

Yue Kwong Lau, Laguna, HK;

Jun Zhang, Huizhou, CN;

David Todd Emerson, Chapel Hill, NC (US);

Inventors:

Chi Keung Chan, Sheung Shui, HK;

Chak Hau Pang, Fanling, HK;

Fei Hong Li, Huizhou, CN;

Yue Kwong Lau, Laguna, HK;

Jun Zhang, Huizhou, CN;

David Todd Emerson, Chapel Hill, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/647 (2013.01); H01L 23/49861 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.


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