The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Mar. 11, 2014
Applicant:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Inventor:
Kosuke Yasooka, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/552 (2006.01); H05K 1/00 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H05K 1/00 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15321 (2013.01);
Abstract
A high-frequency package has: a resin substrate; a high-frequency device mounted on a side of a first surface of the resin substrate; a ground surface conductor of a ground potential formed on a second surface of the resin substrate on an opposite side to the first surface; a transmission line for a high-frequency signal formed in an inner layer of the resin substrate; and a ground via of a ground potential formed within the resin substrate. A through hole is formed in the ground surface conductor. The ground via is placed between the transmission line and the through hole.