The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Sep. 04, 2013
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventor:

Satoru Takaku, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/4875 (2013.01); H01L 21/4878 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/49811 (2013.01); H01L 24/97 (2013.01); H01L 23/3121 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

According to the embodiments, a semiconductor device includes a substrate, a plurality of insulating layers, a lower shield plate, a semiconductor device, an upper shield plate, and a side shield member. A first contact portion is formed on the substrate. The lower shield plate includes a magnetic substance and is provided above the substrate so as to avoid the first contact portion. The semiconductor chip is provided above the lower shield plate and has a second contact portion electrically connected to the first contact portion. The upper shield plate includes a magnetic substance and is provided above the semiconductor chip so as to avoid the second contact portion and a connection member. The side shield member includes a magnetic substance and connects side portions of the lower shield plate and the upper shield plate on which the connection member is not disposed.


Find Patent Forward Citations

Takaku, Satoru. (2017). Semiconductor apparatus and manufacturing method for same (U.S. Patent No. 9685412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9685412

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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