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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9685399 B1

PDFFull Text
Date of Patent:
Jun. 20, 2017

Filed:

Dec. 05, 2013

Power semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Toru Kimura, Tokyo, JP;

Yoichi Goto, Tokyo, JP;

Kiyofumi Kitai, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorneys:

Sughrue Mion, PLLC

Richard C. Turner

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/29 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/4924 (2013.01); H01L 23/49541 (2013.01); H01L 24/32 (2013.01); H01L 25/00 (2013.01); H01L 25/0655 (2013.01); H01L 23/3735 (2013.01); H01L 23/49565 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01013 (2013.01);
Abstract

A power semiconductor device is provided with a base plate thermally connected to the power semiconductor element for heat generated from the power semiconductor element to be conducted to heat radiation fins. An electrically conductive member fixed to the base plate is electrically conducted to the base plate and is connected to ground, and has projections fitted into notches provided in the electrically conductive member. By deforming the projections, the electrically conductive member is fixed to the base plate and electrical conduction can be secured. With this arrangement, noise radiated from the power semiconductor element is reduced and malfunction of the power semiconductor element is suppressed.

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