The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9685270 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 20, 2017

Filed:

Jul. 07, 2014
Applicant:

E I Du Pont DE Nemours and Company, Wilmington, DE (US);

Inventor:

Jay Robert Dorfman, Durham, NC (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 71/00 (2006.01); C08L 75/04 (2006.01); C08L 75/06 (2006.01); H01B 3/12 (2006.01); H01B 3/30 (2006.01); H01G 4/008 (2006.01); H01G 4/14 (2006.01);
U.S. Cl.
CPC ...
H01G 4/14 (2013.01); C08L 63/00 (2013.01); C08L 71/00 (2013.01); C08L 75/04 (2013.01); C08L 75/06 (2013.01); H01B 3/12 (2013.01); H01B 3/302 (2013.01); H01B 3/307 (2013.01); H01G 4/008 (2013.01); C08G 2650/56 (2013.01);
Abstract

This invention is directed to a polymer thick film thermoformable dielectric composition with a high dielectric constant. Dielectrics made from the composition can be used in various electronic applications to enhance the performance of thermoformable capacitive circuits.


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