The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9685187 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 20, 2017

Filed:

Sep. 26, 2014
Applicant:

Western Digital (Fremont), Llc, Fremont, CA (US);

Inventors:

Bin Ouyang, Klong Luang, TH;

Chee Kheng Lim, Pakkret, TH;

Assignee:

WESTERN DIGITAL (FREMONT), LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/06 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); G11B 5/84 (2006.01); B32B 37/14 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
G11B 5/84 (2013.01); B32B 37/14 (2013.01); B32B 38/0008 (2013.01); B32B 38/0012 (2013.01); B32B 38/10 (2013.01); B32B 2038/002 (2013.01); B32B 2038/0016 (2013.01); B32B 2307/208 (2013.01); B32B 2310/0418 (2013.01); B32B 2310/0463 (2013.01); B32B 2310/14 (2013.01);
Abstract

A chip-to-chip eutectic bonding system includes a stage with a top surface, a bottom surface, and a plurality of vacuum apertures extending therebetween and a carrier with a top surface, the top surface including one or more smooth surface portions and one or more rough surface portions, wherein at least one smooth carrier surface portion laterally aligns to at least one vacuum aperture, and at least one of the stage's rough surface portions frictionally couples to at least one of the carrier's rough surface portions when the carrier top surface couples to and opposes the stage bottom surface.


Find Patent Forward Citations

Ouyang, Bin. (2017). Bonding tool and method for high accuracy chip-to-chip bonding (U.S. Patent No. 9685187). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9685187

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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