The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
May. 14, 2009
Applicants:
Hitoshi Wada, Toyota, JP;
Shigeyuki Suga, Toyota, JP;
Takashi Tomikawa, Toyota, JP;
Inventors:
Assignee:
TAIHO KOGYO CO., LTD., Aichi, JP;
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01); C23C 28/02 (2006.01); F16C 33/12 (2006.01); C25D 3/54 (2006.01); C25D 5/10 (2006.01); C25D 7/10 (2006.01); C25D 11/04 (2006.01); C25D 11/26 (2006.01); F16C 33/14 (2006.01);
U.S. Cl.
CPC ...
F16C 33/12 (2013.01); C25D 3/54 (2013.01); C25D 5/10 (2013.01); C25D 7/10 (2013.01); C25D 11/04 (2013.01); C25D 11/26 (2013.01); F16C 33/122 (2013.01); F16C 33/14 (2013.01); F16C 2204/20 (2013.01); F16C 2204/36 (2013.01); F16C 2223/70 (2013.01); Y10T 428/12569 (2015.01); Y10T 428/12972 (2015.01);
Abstract
In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.