The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

May. 15, 2015
Applicant:

Bayer Materialscience Llc, Pittsburgh, PA (US);

Inventors:

Michael S. Robinson, Rocky Face, GA (US);

Stephen J. Harasin, Morgan, PA (US);

Michael T. Wellman, Moundsville, WV (US);

Assignee:

Covestro LLC, Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E01C 13/08 (2006.01); C09D 175/12 (2006.01); B01J 2/30 (2006.01); C08J 3/12 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C09D 175/04 (2006.01); C08G 18/28 (2006.01); C08G 18/32 (2006.01);
U.S. Cl.
CPC ...
E01C 13/08 (2013.01); B01J 2/30 (2013.01); C08G 18/289 (2013.01); C08G 18/324 (2013.01); C08G 18/667 (2013.01); C08G 18/7664 (2013.01); C08J 3/124 (2013.01); C09D 175/04 (2013.01); C09D 175/12 (2013.01);
Abstract

Disclosed are free-flowing particles. These free-flowing particles include: (a) a rubber particle, and (b) a coating deposited over at least a portion of the rubber particle, wherein the coating includes: (1) a polyurethane-urea resin that is a reaction product of a reaction mixture comprising: (i) a polyol having a number average molecular weight of 1800 to 12,000; (ii) an aromatic diamine; (iii) a polyisocyanate; and (iv) a catalyst for the reaction between hydroxyl groups and isocyanate groups; and (2) a solid particle anti-clumping agent. Also disclosed are methods of making and using such free-flowing particles and synthetic turf structures that include an infill of such free-flowing particles.


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