The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Oct. 11, 2016
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Tune-Hune Kao, Hsinchu, TW;

Meng-Chi Huang, Zhongli, TW;

Min-Chieh Chou, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C23C 18/16 (2006.01); C09D 5/24 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1651 (2013.01); C09D 5/24 (2013.01); C23C 18/165 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); H05K 1/0296 (2013.01); H05K 1/0373 (2013.01); H05K 3/107 (2013.01); H05K 3/185 (2013.01); H05K 3/4661 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.


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