The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Jul. 25, 2012
George Whitesides, Newton, MA (US);
Xinyu Liu, Montreal, CA;
Xiujun LI, El Paso, TX (US);
Martin M. Thuo, Southborough, MA (US);
Michael O'brien, Whitefish, MT (US);
Yu Sun, Toronto, CA;
George Whitesides, Newton, MA (US);
Xinyu Liu, Montreal, CA;
XiuJun Li, El Paso, TX (US);
Martin M. Thuo, Southborough, MA (US);
Michael O'Brien, Whitefish, MT (US);
Yu Sun, Toronto, CA;
President and Fellows of Harvard College, Cambridge, MA (US);
Abstract
MEMS devices fabricated using inexpensive substrate materials such as paper or fabric, are provided. Using paper as a substrate, low cost, simple to prepare, lightweight, disposable piezoresistive sensors, including accelerometers are prepared. Signal-processing circuitry can also be patterned on the substrate material. The sensors can be utilized as two-dimensional sensors, or the paper substrate material can be folded to arrange the sensors in a three dimensional conformation. For example, three sensors can be patterned on a paper substrate and folded into a cube such that the three sensors are orthogonally positioned on the faces of a cube, permitting simultaneous measurement of accelerations along three orthogonal directions (x-y-z). These paper-based sensors can be mass produced by incorporating highly developed technologies for automatic paper cutting, folding, and screen-printing. Also provided are methods of modifying paper for use as a substrate material in MEMS devices.