The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Jul. 30, 2012
Applicant:

Erich Thallner, St. Florian, AT;

Inventor:

Erich Thallner, St. Florian, AT;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/20 (2006.01); B32B 37/00 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); B32B 7/04 (2006.01); B32B 37/18 (2006.01); H01L 23/10 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
B32B 37/0076 (2013.01); B32B 7/045 (2013.01); B32B 37/18 (2013.01); H01L 21/6835 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 25/50 (2013.01); B32B 2457/14 (2013.01); H01L 23/10 (2013.01); H01L 23/49827 (2013.01); H01L 23/544 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/27 (2013.01); H01L 25/0657 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0556 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/131 (2013.01); H01L 2224/14145 (2013.01); H01L 2224/276 (2013.01); H01L 2224/2902 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/32052 (2013.01); H01L 2224/32055 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32502 (2013.01); H01L 2224/32506 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75822 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/831 (2013.01); H01L 2224/832 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/351 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24826 (2015.01); Y10T 428/24942 (2015.01);
Abstract

A method for bonding a first substrate to a second substrate including the steps of: making contact of a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, as a result of which a common contact area is formed; and producing a bond interconnection between the first substrate and the second substrate outside the common contact area. The invention also relates to a corresponding device and a substrate composite of a first substrate and a second substrate, in which a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, forms a common contact area, outside the common contact area there being a bond interconnection between the first substrate and the second substrate.


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