The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Apr. 15, 2015
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

Philip R. Belanger, Acton, ME (US);

Paul M. Lutjen, Kennebunkport, ME (US);

Richard K. Hayford, Cape Neddick, ME (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 35/36 (2006.01); B23P 6/00 (2006.01); B22D 19/10 (2006.01); C22C 19/07 (2006.01); C22C 19/03 (2006.01); B23K 35/30 (2006.01); B23K 1/00 (2006.01); F01D 5/00 (2006.01); F01D 11/12 (2006.01);
U.S. Cl.
CPC ...
B23P 6/005 (2013.01); B23K 1/0018 (2013.01); B23K 31/02 (2013.01); B23K 35/3033 (2013.01); B23K 35/3046 (2013.01); C22C 19/03 (2013.01); C22C 19/07 (2013.01); F01D 5/005 (2013.01); F01D 11/122 (2013.01); F05D 2240/11 (2013.01);
Abstract

A structural element and method for repairing a damaged portion of a metal component utilizes a preform configured to engage with the metal component and receive a repair material. The preform may be made of a material having a first melting point, and the repair material may be made of a material having a second melting point that is lower than the first melting point. The preform may be a mold configured to reconstruct the shape of the damaged portion of the metal component. The repair material may include a first material and an additive material, such as boron. The repair material may have a melting point that is approximately 40 degrees Fahrenheit lower than the melting point of the metal component.


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