The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Feb. 27, 2014
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventor:

Kuang-Jung Chen, Zhubei, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A package of an environmentally sensitive electronic device and a fabricating method thereof are provided, wherein the package may include a first substrate, a second substrate, the environmentally sensitive electronic device, a packaging body, and a filler. In one or more embodiments, the environmentally sensitive electronic device may be disposed on the first substrate and located between the first substrate and the second substrate. The filler is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device. The packaging body is sandwiched between the first substrate and the second substrate and encloses the environmentally sensitive electronic device and the filler. A material for the packaging body may include a bonding of transition metal and metalloid.


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