The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jun. 20, 2016
Applicant:

Innolux Corporation, Jhu-Nan, Miao-Li County, TW;

Inventors:

Chia-Cheng Liu, Jhu-Nan, TW;

Chia-Hsiung Chang, Jhu-Nan, TW;

An-Chang Wang, Jhu-Nan, TW;

Chao-Hsiang Wang, Jhu-Nan, TW;

Yang-Chen Chen, Jhu-Nan, TW;

Assignee:

INNOLUX CORPORATION, Jhu-Nan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); G02F 1/1345 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); G02F 1/1345 (2013.01); G02F 1/13458 (2013.01); H01L 24/06 (2013.01); H05K 1/092 (2013.01); H05K 1/117 (2013.01); H05K 3/323 (2013.01); H01L 23/4922 (2013.01); H01L 24/07 (2013.01); H01L 24/09 (2013.01); H01L 24/26 (2013.01); H01L 24/31 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 2225/1041 (2013.01); H01L 2924/13069 (2013.01); H01L 2924/365 (2013.01); H05K 2201/10136 (2013.01);
Abstract

A substrate structure includes a first substrate, a plurality of first bonding pads, a second substrate and a connecting layer. The first substrate has an element configuration area and a peripheral area. The peripheral area is located around the element configuration area. The first bonding pads are configured spacing at the peripheral area, and a gap is provided between two adjacent first bonding pads. The first bonding pads are located between the first substrate and the second substrate. The connecting layer is located between the first bonding pads and the second substrate. The part of the connecting layer close to the element configuration area is configured with a plurality of first arc edges.


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