The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Feb. 22, 2016
Applicant:

Harris Corporation, Melbourne, FL (US);

Inventors:

Louis Joseph Rendek, Jr., Melbourne, FL (US);

Travis L. Kerby, Malabar, FL (US);

Casey Philip Rodriguez, Indialantic, FL (US);

Michael Raymond Weatherspoon, West Melbourne, FL (US);

Assignee:

HARRIS CORPORATION, Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 3/28 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H05K 1/0346 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/287 (2013.01); H01L 21/4846 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81855 (2013.01); H01L 2224/8388 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83359 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/381 (2013.01); H05K 3/3436 (2013.01); H05K 3/3452 (2013.01); H05K 3/3484 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10212 (2013.01);
Abstract

A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.


Find Patent Forward Citations

Loading…