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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9681541 B1

PDFFull Text
Date of Patent:
Jun. 13, 2017

Filed:

Apr. 16, 2016

Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Toshiyuki Higashida, Fukushima, JP;

Hidetsugu Motobe, Fukushima, JP;

Daisuke Nii, Fukushima, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Tremesha S Willis

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C08G 59/40 (2006.01); C08K 5/09 (2006.01); C08L 25/08 (2006.01); C08L 63/00 (2006.01); C08G 59/42 (2006.01); C08L 63/08 (2006.01); B32B 5/02 (2006.01); B32B 15/082 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 15/092 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B32B 5/02 (2013.01); B32B 15/082 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); C08G 59/40 (2013.01); C08G 59/4261 (2013.01); C08G 59/4284 (2013.01); C08J 5/24 (2013.01); C08K 5/09 (2013.01); C08L 25/08 (2013.01); C08L 63/00 (2013.01); C08L 63/08 (2013.01); H05K 1/0296 (2013.01); H05K 1/03 (2013.01); B32B 15/092 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2270/00 (2013.01); B32B 2307/20 (2013.01); B32B 2307/206 (2013.01); B32B 2307/30 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/50 (2013.01); B32B 2457/08 (2013.01); C08J 2363/08 (2013.01); C08J 2435/06 (2013.01); C08L 2203/206 (2013.01); H05K 2201/012 (2013.01);
Abstract

Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

Find Patent Forward Citations

Quick Actions:

Higashida, Toshiyuki. (2017). Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board (U.S. Patent No. 9681541). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9681541

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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