The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Oct. 31, 2014
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Andrew Thomas Barfknecht, Menlo Park, CA (US);

Klaus-Guenter Oppermann, Holzkirchen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0523 (2013.01); H03H 9/059 (2013.01); H03H 9/1014 (2013.01); H03H 9/1071 (2013.01); H05K 3/284 (2013.01); H05K 2201/10083 (2013.01);
Abstract

A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.


Find Patent Forward Citations

Loading…